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Mitarbeitende von EV Group und des Fraunhofer IZM-ASSID neben einem vollautomatischen EVG®850 DB UV-Laser-Debonding- und Reinigungssystem, installiert im neu eröffneten Center for Advanced CMOS and Heterointegration Saxony (CEASAX) von Fraunhofer in Dresden, Deutschland. [Vin links nach recths: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf / EV Group and Fraunhofer IZM-ASSID personnel next to an EVG®850 DB fully automated UV laser debonding and cleaning system installed in Fraunhofer’s newly established Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. [From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf
  • Electronics (wafers, semiconductors, microchips,...)

ST. FLORIAN, Austria and MORITZBURG, Germany Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX)

EV Group and Fraunhofer IZM-ASSID expand partnership in Wafer Bonding for Quantum Computing applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Fraunhofer IZM-ASSID (All Silicon System Integration Dresden), a division of Fraunhofer IZM that provides world-leading applied research in semiconductor 3D wafer…

  • Company

Das internationale Medizintechnologieunternehmen B. Braun hat zum 31. Mai 2024 sein Reutlinger Tochterunternehmen TETEC AG an die kanadische Octane Medical Group veräußert.

B. Braun veräußert TETEC AG an kanadischen Spezialisten Octane Medical

TETEC ist auf regenerative Medizin spezialisiert und hat mit NOVOCART zwei Produkte entwickelt, mit denen durch körpereigene Zellzüchtung Knorpelschäden am Knie behandelt werden. B. Braun hat in den USA bereits seit über zehn Jahren mit Octane Medical zusammengearbeitet. Jetzt hat der kanadische…

Redipor® terminally sterilised plastic bottled media products are tougher, lighter and require lower recycling temperatures than glass to support reduction of carbon expense.
  • Packaging, Foil

Cherwell’s new Redipor® Plastic Bottle media range provides more sustainable alternative to glass bottled media for sterile pharmaceutical manufacturing

Terminally sterilised plastic bottled media range launched to support sustainability initiatives

Cherwell, cleanroom microbiology solutions expert, has introduced a new Redipor® Plastic Bottle prepared media range in response to a request from a large pharmaceutical company for support in meeting its sustainability targets. The new terminally sterilised plastic bottled media products have been…

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