-
- Cleaning | procedures, devices, agents, media (Wipers, Swaps,...)
F&S Bondtec Semiconductor and acp systems conclude cooperation agreement
Top-quality wire bonding connections guaranteed thanks to quattroClean snow-jet cleaning
Ultrasonic wire bonding has been established as a contacting method in the microelectronics and semiconductor industry for many years. The technology is also ideally suited for electrically interconnecting battery cells. To ensure one of the most important prerequisites for high-quality and durable…