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Die Smart Blister Card von Schreiner MediPharm lässt sich ganz einfach auf der Rückseite einer Standard-Blisterverpackung aufbringen und erweitert diese um eine digitale Therapiekontrolle. / Schreiner MediPharm’s Smart Blister Card can easily be applied to the back of a standard blister pack and extends it by digital medication adherence monitoring.
  • Auszeichnung

Award-Winning High-Tech Solution for Digital Adherence Monitoring

Schreiner MediPharm’s Smart Blister Card can easily be applied to the back of a standard blister pack and extends it by digital medication adherence monitoring.

Every year the European Association of the Self-Adhesive Label Industry (FINAT) recognizes the industry’s best products. This year the Smart Blister Card from Schreiner MediPharm was the winner in the prestigious “Innovation & Electronic Printing – Electronic Devices” category. It extend…

  • Electronics (wafers, semiconductors, microchips,...)

ASML is making a substantial commitment in imec's future state-of-the-art pilot line

Imec and ASML sign Memorandum of Understanding (MoU) to support semiconductor research and sustainable innovation in Europe

Imec, a leading research and innovation hub in nanoelectronics and digital technologies, and ASML Holding N.V. (ASML), a leading supplier to the semiconductor industry, today announce that they intend to intensify their collaboration in the next phase of developing a state-of-the-art high-numerical…

Beim TEM-Entgraten wird der abzutragende Grat durch eine chemische Reaktion zwischen Werkstoff und Prozessgas verbrannt. Das Verfahren kann für Werkstücke aus verschiedenen Metallen sowie Thermoplasten mit komplexen Geometrien und zahlreichen, schwer zugänglichen Entgratstellen eingesetzt werden. (Bildquelle: ATL Luhden) / In TEM deburring, the burr to be removed is oxidised by a chemical reaction occurring between the material and the process gas. The process can be used for workpieces made of various metals, as well as for thermoplastics with complex geometries and numerous, difficult to access deburring points. (Image source: ATL Luhden) Das Ultraschallentgraten erfolgt in einem Prozesswasserbecken, in die Bauteile an die hochfrequente Ultraschall-Sonotrode geführt werden. (Bildquelle: ultraTEC) / Ultrasonic deburring takes place in a water basin in which components are advanced to the high-frequency ultrasonic sonotrode.
(Image source: ultraTEC) Mit dem ECM-Verfahren lassen sich Werkstücke nicht nur entgraten, es können Bauteile, hier ein Stapler (Klammergerät) zum Verschließen von Wunden durch Klammern, hergestellt werden. Die Mikrostrukturierung erfolgt in einem Mehrfachwerkzeug. (Bildquelle: EMAG ECM) / Not only can workpieces be deburred with the ECM process, it can also be used to produce components – in this case a stapler used for closing wounds. Microstructuring takes place in a multiple tool. (Image source: EMAG ECM)
  • Trade fair

5th Leading Trade Fair for Deburring Technology and Precision Surface Finishing 10 to 12 October 2023 at the Karlsruhe Exhibition Centre, Germany

Megatrends Looking for Solutions

Whether the mobility and energy transition, sustainability, health or safety is involved – global megatrends have a profound effect on industrial production. They’re also impacting demands placed on burr-free components, as well as cleanliness and surface finishing quality. As the only internati…

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