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- Trade fair
Practical digitalization solutions for needs-based, secure processes: Fraunhofer IVV at interpack 2023
The Fraunhofer Institute for Process Engineering and Packaging will be pre-senting its new technologies and solutions for business in the packaging and food industry at the interpack trade fair from May 4–10, 2023 at the VDMA booth C54 in hall 4. These new developments can help companies establish…