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All publications for the rubric Electronics (wafers, semiconductors, microchips,...)

Vereinzelte OFET-Substrate des Fraunhofer IPMS. © Fraunhofer IPMS / Diced OFET substrates from Fraunhofer IPMS. © Fraunhofer IPMS OFET-Substrate des Fraunhofer IPMS als Wafer. © Fraunhofer IPMS / OFET substrates from Fraunhofer IPMS as wafer. © Fraunhofer IPMS OFET-Substrate des Fraunhofer IPMS im Waffle-Pack. © Fraunhofer IPMS / OFET substrates from Fraunhofer IPMS in a waffle pack. © Fraunhofer IPMS
  • Electronics (wafers, semiconductors, microchips,...)

Substrates for organic field-effect transistors (OFET) for the development of high-tech materials

Customized silicon chips from Saxony for material characterization of printed electronics

How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures silicon substrates for this purpose. This enables the fundamental electrical characterization of materials such as a novel grap…

  • New building

Spanish government, region of Andalusia and imec sign Memorandum of Understanding (MoU) with the intention to establish a new 300mm R&D process line for specialized chip technologies

New R&D facility will complement imec’s 300mm cleanroom in Leuven with new processes and materials to boost innovation in upcoming domains such as health and augmented and virtual reality.

The Spanish government, together with the regional government of Andalusia and imec, a world-leading research and…

The design pathfinding PDK allows for digital designs with 2nm Gate All Around (GAA) technology including backside connectivity. The design pathfinding PDK allows for digital designs with 2nm Gate All Around (GAA) technology including backside connectivity.
  • Electronics (wafers, semiconductors, microchips,...)

The design pathfinding PDK lowers the threshold for academia and industry to access the most advanced semiconductor technologies

Imec Launches the First Design Pathfinding Process Design Kit for N2 Node

At the 2024 IEEE International Solid-State Circuits Conference (ISSCC), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, launches its open process design kit (PDK) with a concomitant training program offered through EUROPRACTICE. The PDK will enable virt…

AIXTRON's neues Innovationszentrum Herzogenrath, 23.11.2023: Spatenstich zum Bau des neuen Innovationszentrums der AIXTRON SE am Standort Herzogenrath. V.l.n.r.: Dr. Christian Danninger, Finanzvorstand CFO AIXTRON SE, Dr. Benjamin Fadavian, Bürgermeister Stadt Herzogenrath, Dr. Felix Grawert, Vorsitzender des Vorstands CEO & President AIXTRON SE, Kim SChindelhauer, Aufsichtsratsvorsitzender AIXTRON SE, Franz-Josef Türck-Hövener, Technischer Beigeordneter Stadt Herzogenrath. (Foto: AIXTRON/F.Stark)
  • New building

The leading provider of deposition equipment to the semiconductor industry is investing around EUR 100 million at its headquarters in Herzogenrath, Germany. With this, AIXTRON is laying an important foundation for further successful growth.

AIXTRON starts construction of new innovation center

AIXTRON SE (FSE: AIXA, ISIN DE000A0WMPJ6) has officially started the construction of the new innovation center at its headquarters in Herzogenrath, Germany. The leading provider of deposition equipment to the semiconductor industry is investing around EUR 100 million in 1000m2 of clean room with add…

Konzeptbild der neuen Fab. © studiobrand.3dvisuals / Concept image of the new high-tech fab. © studiobrand.3dvisuals
  • Electronics (wafers, semiconductors, microchips,...)

Investment in new production tool for the semiconductor equipment industry.

State-of-the-art electron beam lithography system for Jenoptik’s high-tech fab in Dresden

Jenoptik is investing a low double-digit million-euro amount in a state-of-the-art system for the high-tech fab currently under construction in Dresden. The new electron-beam lithography system (E-Beam) will be used to manufacture high-precision micro-optical components for customers in the semicond…

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