Researchers at Fraunhofer IAF have made a breakthrough in the field of semiconductor materials: With aluminum yttrium nitride (AlYN), they have succeeded in fabricating and characterizing a new and promising semiconductor material using the MOCVD process. Due to its excellent material properties and…
In order to make quantum computers usable, developing the control technology is at least as important for scaled systems, yet it is still in its infancy. Project ARCTIC brings together 36 international partners from industry, academia and leading RTOs to establish a complete and comprehensive Europe…
Für die DUV-Lithografie hat Steinmeyer am Standort Dresden, Europas größtem IKT-/Mikroelektronik-Zentrum, eine ultrakompakte, hochpräzise Positionierlösung zur Wafer-Belichtung in trockener, sauerstofffreier Stickstoff-Atmosphäre entwickelt. Die innovative Baugruppe ist als optionales Add-on z…
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, today announced the demonstration of high quality 300mm-Si-based quantum dot spin qubit processing with devices resulting in a statistically relevant, average charge noise of 0.6µeV/√Hz at 1Hz. In view…
Bei High-End-Anwendungen in der Halbleitertechnik, Elektronik oder Forschung und Entwicklung schreitet die Miniaturisierung und Automatisierung stetig voran. Positionier- und Antriebssysteme müssen unter extremen Umgebungsbedingungen präzise, sauber, zuverlässig und wartungsarm arbeiten. Die zur…
The BIOSYNTH project is funded by the Fraunhofer Society and aims to develop a new microchip platform that enables efficient and digitally controllable cell-free biosynthesis. The Fraunhofer Institute for Photonic Microsystems IPMS leads the consortium and collaborates with the Institute for Toxicol…
Die Verpackung von Wafern in sogenannte FOSB, das Kürzel steht für Front Opening Shipping Boxen, ist ein aufwendiger Prozess, der unter Reinraumbedingungen stattfinden muss. Um menschliche Eingriffe dabei gänzlich zu vermeiden, hat ein bayerisches Unternehmen eine vollautomatische Lösung entwick…
The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures individual heatable test chips for the characterization of new gas sensor materials. Deposited sensing layers and their application-specific parameters, such as sensitivity and selectivity, can thus be specifically eva…
This week, at the 2024 IEEE Symposium on VLSI Technology & Circuits (2024 VLSI), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents for the first time electrically functional CMOS CFET devices with stacked bottom and top source/drain contacts…
![Mitarbeitende von EV Group und des Fraunhofer IZM-ASSID neben einem vollautomatischen EVG®850 DB UV-Laser-Debonding- und Reinigungssystem, installiert im neu eröffneten Center for Advanced CMOS and Heterointegration Saxony (CEASAX) von Fraunhofer in Dresden, Deutschland. [Vin links nach recths: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf / EV Group and Fraunhofer IZM-ASSID personnel next to an EVG®850 DB fully automated UV laser debonding and cleaning system installed in Fraunhofer’s newly established Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. [From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf](/uploads/images/_scale/dsc4037klein_169_626x352.jpg "Mitarbeitende von EV Group und des Fraunhofer IZM-ASSID neben einem vollautomatischen EVG®850 DB UV-Laser-Debonding- und Reinigungssystem, installiert im neu eröffneten Center for Advanced CMOS and Heterointegration Saxony (CEASAX) von Fraunhofer in Dresden, Deutschland. [Vin links nach recths: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf / EV Group and Fraunhofer IZM-ASSID personnel next to an EVG®850 DB fully automated UV laser debonding and cleaning system installed in Fraunhofer’s newly established Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. [From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf")
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Fraunhofer IZM-ASSID (All Silicon System Integration Dresden), a division of Fraunhofer IZM that provides world-leading applied research in semiconductor 3D wafer…
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