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All publications for the rubric Electronics (wafers, semiconductors, microchips,...)

300-mm-Reinraum des Fraunhofer IPMS. © Fraunhofer IPMS / 300 mm cleanroom at the Fraunhofer IPMS. © Fraunhofer IPMS Luftbildaufnahme von Infineon Dresden. © Infineon Technologies AG / Aerial view of Infineon Dresden. © Infineon Technologies AG „Smart-Power-Technologien“ in Anwendungen für Endverbraucher. © Infineon Technologies AG /
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  • Electronics (wafers, semiconductors, microchips,...)

Intelligent energy management for the future

Fraunhofer IPMS supports the 300 mm process development of smart power technologies for the semiconductor manufacturer Infineon at the Dresden site

In a joint development project spanning around one year, important progress was made in the production of “Smart power technologies”. Fraunhofer IPMS provided significant support to the semiconductor manufacturer Infineon by supplying selected process modules within the entire CMOS process value…
5DOF Miniatur-XYZ-Phi-Delta Positioniersystem für die aktive Ausrichtung und Montage von Optiken. (Copyright: Steinmeyer Mechatronik)
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  • Electronics (wafers, semiconductors, microchips,...)

Hochpräzises Positioniersystem für die aktive Ausrichtung und Montage von Optiken

Innovativer 5-Achs-Aligner für die Halbleiterindustrie

Mit dem 5DOF Miniatur-XYZ-Phi-Delta Positioniersystem bietet Steinmeyer Mechatronik eine innovative Lösung für hochpräzise Ausrichtprozesse. Die Kombination aus Tripod und XY-Kreuztisch gewährleistet ein Höchstmaß an Präzision, Robustheit sowie Zuverlässigkeit und begeistert gleichzeitig mit…
Vereinzelte OFET-Substrate des Fraunhofer IPMS. © Fraunhofer IPMS / Diced OFET substrates from Fraunhofer IPMS. © Fraunhofer IPMS OFET-Substrate des Fraunhofer IPMS als Wafer. © Fraunhofer IPMS / OFET substrates from Fraunhofer IPMS as wafer. © Fraunhofer IPMS OFET-Substrate des Fraunhofer IPMS im Waffle-Pack. © Fraunhofer IPMS / OFET substrates from Fraunhofer IPMS in a waffle pack. © Fraunhofer IPMS
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  • Electronics (wafers, semiconductors, microchips,...)

Substrates for organic field-effect transistors (OFET) for the development of high-tech materials

Customized silicon chips from Saxony for material characterization of printed electronics

How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures silicon substrates for this purpose. This enables the fundamental electrical characterization of materials such as a novel grap…
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  • New building

Spanish government, region of Andalusia and imec sign Memorandum of Understanding (MoU) with the intention to establish a new 300mm R&D process line for specialized chip technologies

New R&D facility will complement imec’s 300mm cleanroom in Leuven with new processes and materials to boost innovation in upcoming domains such as health and augmented and virtual reality.

The Spanish government, together with the regional government of Andalusia and imec, a world-leading research and…
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