Die Verpackung von Wafern in sogenannte FOSB, das Kürzel steht für Front Opening Shipping Boxen, ist ein aufwendiger Prozess, der unter Reinraumbedingungen stattfinden muss. Um menschliche Eingriffe dabei gänzlich zu vermeiden, hat ein bayerisches Unternehmen eine vollautomatische Lösung entwick…
The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures individual heatable test chips for the characterization of new gas sensor materials. Deposited sensing layers and their application-specific parameters, such as sensitivity and selectivity, can thus be specifically eva…
This week, at the 2024 IEEE Symposium on VLSI Technology & Circuits (2024 VLSI), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents for the first time electrically functional CMOS CFET devices with stacked bottom and top source/drain contacts…
![Mitarbeitende von EV Group und des Fraunhofer IZM-ASSID neben einem vollautomatischen EVG®850 DB UV-Laser-Debonding- und Reinigungssystem, installiert im neu eröffneten Center for Advanced CMOS and Heterointegration Saxony (CEASAX) von Fraunhofer in Dresden, Deutschland. [Vin links nach recths: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf / EV Group and Fraunhofer IZM-ASSID personnel next to an EVG®850 DB fully automated UV laser debonding and cleaning system installed in Fraunhofer’s newly established Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. [From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf](/uploads/images/_scale/dsc4037klein_169_626x352.jpg "Mitarbeitende von EV Group und des Fraunhofer IZM-ASSID neben einem vollautomatischen EVG®850 DB UV-Laser-Debonding- und Reinigungssystem, installiert im neu eröffneten Center for Advanced CMOS and Heterointegration Saxony (CEASAX) von Fraunhofer in Dresden, Deutschland. [Vin links nach recths: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf / EV Group and Fraunhofer IZM-ASSID personnel next to an EVG®850 DB fully automated UV laser debonding and cleaning system installed in Fraunhofer’s newly established Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. [From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf")
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Fraunhofer IZM-ASSID (All Silicon System Integration Dresden), a division of Fraunhofer IZM that provides world-leading applied research in semiconductor 3D wafer…
Due to their stability and resistance to water and grease, PFAS chemicals (short for per- and polyfluoroalkyl substances) are used in a wide range industries, but they are harmful to health and the environment. Membranes containing PFAS are used in many semiconductor manufacturing processes, for exa…
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and ASML Holding N.V. (ASML), a leading lithography supplier to the semiconductor industry, today announced the opening of the High NA EUV Lithography Lab in Veldhoven, the Netherlands, a lab jointly run b…
This week, at the 2024 IEEE Electronic Components and Technology Conference (ECTC), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <35…
In a joint development project spanning around one year, important progress was made in the production of “Smart power technologies”. Fraunhofer IPMS provided significant support to the semiconductor manufacturer Infineon by supplying selected process modules within the entire CMOS process value…
Präzision, Dynamik, Zuverlässigkeit und Prozesskontinuität haben in der Elektronikfertigung und Halbleiterindustrie oberste Priorität. Rollon, Spezialist für lineare Bewegungslösungen, begegnet diesen Anforderungen mit einem breiten Produktportfolio, einem tiefen Anwendungsverständnis sowie e…
Mit dem 5DOF Miniatur-XYZ-Phi-Delta Positioniersystem bietet Steinmeyer Mechatronik eine innovative Lösung für hochpräzise Ausrichtprozesse. Die Kombination aus Tripod und XY-Kreuztisch gewährleistet ein Höchstmaß an Präzision, Robustheit sowie Zuverlässigkeit und begeistert gleichzeitig mit…
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