![TEM-Querschnitte von Ru-Bahnen mit 18 nm Metallabstand: (links) AR 3, (rechts) AR 6. Die TEMs zeigen ein nahezu vertikales Profil der Ru-Bahnen und die Skalierbarkeit des aktuellen Schemas zu höheren ARs. / Cross-section TEMs of Ru lines with 18nm metal pitch: (left) AR 3, (right) AR 6. The TEMs demonstrate a nearly vertical profile of the Ru lines and scalability of the current scheme towards higher ARs. TEM-Querschnitte von Ru-Bahnen mit 18 nm Metallabstand: (links) AR 3, (rechts) AR 6. Die TEMs zeigen ein nahezu vertikales Profil der Ru-Bahnen und die Skalierbarkeit des aktuellen Schemas zu höheren ARs. / Cross-section TEMs of Ru lines with 18nm metal pitch: (left) AR 3, (right) AR 6. The TEMs demonstrate a nearly vertical profile of the Ru lines and scalability of the current scheme towards higher ARs.](/uploads/images/_scale/imecsemidamascene_169_626x352.jpg)
-
- Conference
Imec Shows Path to Line Resistance Halving using Semi-Damascene with High-Aspect-Ratio Processing
At the 2022 IEEE International Interconnect Technology Conference (IITC 2022), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presented options to reduce the metal line resistance at tight metal pitches, mitigating the resistance/capacitance (RC) incre…