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All publications for the rubric Electronics (wafers, semiconductors, microchips,...)

Luc Van de hofe and Nicole Hoffmeister-Kraut
  • Electronics (wafers, semiconductors, microchips,...)

New partnership enables an innovative network together with academia and industry partners to strengthen digital sovereignty in Europe

Baden-Württemberg attracts imec to lead development of chiplet-based technology for automotive applications

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and the State Government of Baden-Württemberg, Germany, today announced, at the Hannover Trade Fair, the launch of the Advanced Chip Design Accelerator (ACDA). The new imec competence center in Baden-Wür…

Abbildung 1 – Top-down-REM-Aufnahmen von Mäandern (links) und Gabeln (rechts) mit 20 nm Abstand nach der Musterübertragung in eine TiN-Hartmaske. / Figure 1 - Top-down SEM pictures of 20nm pitch meanders (left) and forks (right) after pattern transfer into TiN hard mask. Abbildung 2 – TEM-Bild metallisierter Drähte mit 20 nm Abstand nach einem chemisch-mechanischen Poliervorgang (CMP). / Figure 2 - TEM picture of metallized 20nm pitch wires after a chemical mechanical polishing (CMP) step.
  • Electronics (wafers, semiconductors, microchips,...)

First electrical tests at 20nm pitch present a next milestone in validating the High NA extreme ultraviolet (EUV) patterning ecosystem

Imec demonstrates electrical yield for 20nm pitch metal lines obtained with High NA EUV single patterning

This week at SPIE Advanced Lithography + Patterning, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents the first electrical test (e-test) results obtained on 20nm pitch metal line structures patterned after single-exposure High NA EUV lithography…

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Kretz + Wahl HJM C-Tec Hydroflex