300 mm wet process technology, futuristic HoloLens presentations and much more await visitors at the AP&S booth at SEMICON Europa 2017

From 14. to 17. November the semiconductor industry will gather at the SEMICON Europa trade fair, for the first time co-located with productronica in Munich, Germany. AP&S as one of the exhibi-tors is ready to welcome visitors at the booth 1739 in hall B1.

“The AP&S IoT solutions will be one of this year’s highlights”, says Christoph Kluge, Director Soft-ware Development, and adds, “We will present our latest Microsoft HoloLens project, so that our visitors will be able to step into the virtual world and interact with our wet process tools directly at the booth. Furthermore, interested parties can try the AP&S Web Worker App, a tool enabling a comfort and time-saving access to the full data archive of wet process applications, with any device and from all over the world.”

Another focus will be the fully automated 200mm and 300mm wet benches for high volume produc-tion according to the latest market requirements. Among them the recently developed 300 mm wet bench TeraStep ™, that handles up to 50 wafers at once, as well as the 200 mm A-Series wet pro-cess tool, which is available with 100 wafer half-space feature.

The AP&S process engineers will be on-site to introduce the possibilities of the in-house laboratory (Demo Center), such as tool demonstrations, individual development support and trainings.

Not only innovative wet process tools but also all accompanying services, like refurbishment of used tools, tool relocations and spare parts delivery will be presented at the booth as essential parts of the AP&S After Sales Unit.   

“With our wide range of products and services we offer our customers everything they need for efficient wet processes from one source. Therefore, a visit of our booth pays off for everyone in-volved in these processes”, summarizes Tobias Bausch, Director Sales and Marketing.   

Requests for a meeting at SEMICON Europa can be sent to sales@ap-s.de