STC Standard Technology Corp. Taiwan becomes new distribution partner of AP&S. Partners celebrate the cooperation at a joint booth at SEMICON Taiwan 2017.

AP&S International GmbH and the new partner STC Standard Technology Corp. Taiwan start into the cooperation with a common booth at the upcoming SEMICON Taiwan event, which will take place from 13th to 15th  September 2017 in Taipei, Taiwan.

“Taiwan, as one of the world’s major producers of electronic products, belongs to the most important regions for the semiconductor industry globally. Correspondingly high is the interest for advanced wet process solutions in this market. The goal of our new partnership with this local player is to cover this demand efficiently”, states Oliver Pohl, responsible for the international distributor network at AP&S.

“Since 2016 we have already successfully cooperated with the company CLC Tech, who was and will remain the exclusive Taiwanese distributor for our cassette, box and foup cleaner CB II and CB III. With STC, as a new distributor for our single wafer and wet bench product portfolio, our Taiwanese customers and prospective business partners have a reliable contact person right at their front door. STC is well established in the market since 1988, is an expert in his field and is familiar with the specific needs of the local market. Together we offer convenient access to required information for interested parties and achieve short distances between the customer and equipment provider, who can be quickly on-site on request.” 

At the SEMICON Taiwan event AP&S and STC will present the full range of AP&S wet process solutions. Highlights of the single wafer area will be the unique AP&S SpinLift-off tool, which processes with DMSO (an EH&S uncritical substance) and the SpinMask tool, which provides outstanding mask cleaning results.

Within the wet bench portfolio the partners will emphasize the A-Series wet process tool, which is available with 100 wafer half-space feature for high volume production and the AP&S Vulcanio bench, a fully automated e-less plating tool. Both wet benches are capable of handling up to 300 mm wafers.