![Von links nach rechts: Dr. Michael Heckmeier (CEO der Siltronic AG), Claudia Schmitt (CFO der Siltronic AG), Niew Bock Cheng (Site President Siltronic Singapore) und Bernhard Schmidt (Siltronic Senior Vice President und Projektleiter) (Foto: © Siltronic AG) / From left to right: Dr. Michael Heckmeier (CEO of Siltronic AG), Claudia Schmitt (CFO of Siltronic AG), Niew Bock Cheng (Site President Siltronic Singapore) and Bernhard Schmidt (Siltronic Senior Vice President and Project Lead) (Photo: © Siltronic AG) Von links nach rechts: Dr. Michael Heckmeier (CEO der Siltronic AG), Claudia Schmitt (CFO der Siltronic AG), Niew Bock Cheng (Site President Siltronic Singapore) und Bernhard Schmidt (Siltronic Senior Vice President und Projektleiter) (Foto: © Siltronic AG) / From left to right: Dr. Michael Heckmeier (CEO of Siltronic AG), Claudia Schmitt (CFO of Siltronic AG), Niew Bock Cheng (Site President Siltronic Singapore) and Bernhard Schmidt (Siltronic Senior Vice President and Project Lead) (Photo: © Siltronic AG)](/uploads/images/_scale/csm_20231107_firstwaferoutsingapore_d0df5da0e1_169_626x351.jpg)
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- Electronics (wafers, semiconductors, microchips,...)
Siltronic AG produces first wafers in its new Singapore fab
On 7th November 2023 Siltronic announced the production of the first wafers in its latest state-of-the-art 300 mm fab in Singapore. The production marks an important milestone in the strategic capacity expansion of Siltronic’s global production network.
"It fills me with immense pride to see the produ…