ST. FLORIAN, Austria and MORITZBURG, Germany Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX)

EV Group and Fraunhofer IZM-ASSID expand partnership in Wafer Bonding for Quantum Computing applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Fraunhofer IZM-ASSID (All Silicon System Integration Dresden), a division of Fraunhofer IZM that provides world-leading applied research in semiconductor 3D wafer…

High-End Performance Packaging vom Wafer bis zum System. © Fraunhofer IZM / High-End Performance Packaging from wafer to system. © Fraunhofer IZM

Auf dem Weg zu marktreifen Quantentechnologien: Im Berliner QuantumPackaging Lab werden Packaging-Technologien für die Quantenphotonik entwickelt. © Fraunhofer IZM | Matthildur Valfells / On the way to market-ready quantum technologies: Packaging technologies for quantum photonics are being developed at the Berlin QuantumPackaging Lab. © Fraunhofer IZM | Matthildur Valfells

Chipaufbau für die Auslese-Elektronik in Quantencomputern auf Kryo-Testsockel. © Fraunhofer IZM | Volker Mai / Chip assembly for readout electronics in quantum computers on cryo test pedestal. © Fraunhofer IZM | Volker Mai

Ein historisches Treffen an unserem Institut, das den Beginn einer außergewöhnlichen Partnerschaft darstellt: Der 1. FMD-Intel-Workshop zur heterogenen 3D-Integration für 2030+ am 28. Oktober 2022 in Berlin. © Fraunhofer IZM

Glas-Interposer mit drei montierten Daisy-Chain-Testchips. Die Dicke des Glas-Interposers beträgt 450 µm mit vollständig Cu-gefüllten TGVs und RDL-Routing auf beiden Seiten. Glas kann eine überlegene Leistung für HF-Anwendungen bieten (je nach Glastyp) und zu einem Interposer mit Dicken im Bereich von 50-800 µm verarbeitet werden. TGVs können für die Strom- oder Signalführung oder zur Verbesserung des Wärmemanagements eingesetzt werden. © Fraunhofer IZM / Glass interposer with 3 assembled daisy chain test chips. The thickness of the glass interposer 450 µm with completely Cu-filled TGVs and RDL routing on both sides. Glass can offer a superior performance for RF applications (depending on glass type) and can be processed to an interposer with thicknesses in the range of 50-800 µm, TGVs can be used for power or signal routing or to improve thermal management. © Fraunhofer IZM

Silizium-Interposer mit zwei montierten Risk-V-basierten Chiplets und zwei Speicherstapeln mit hoher Bandbreite (HBM2) für Hochleistungsrechner und KI-Workloads. Chip-/Systemdesign: ETH Zürich, Interposer-Fertigung und Chip-Montage. © Fraunhofer IZM / Silicon interposer with two assembled Risk-V-based chiplets and two high bandwidth memory stacks (HBM2) for high performance computing and AI workloads. Chip/system design: ETH Zurich, interposer finish and chip assembly. © Fraunhofer IZM

Prof. Dr.-Ing. Martin Schneider-Ramelow, Institutsleiter des Fraunhofer IZM. © Fraunhofer IZM / Prof. Dr.-Ing. Martin Schneider-Ramelow, director of Fraunhofer IZM. © Fraunhofer IZM

26.10.2023
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Science

Pioneering work for the microelectronics of tomorrow: From Chiplet Integration to Cooling - Challenges in High-End Performance Packaging

The future of microelectronics faces exciting developments and important trends. But how will this technological sector develop in the coming years? Which application areas will significantly drive 2.5D/3D hetero-integration and high-end performance packaging, and where are the limits of what is phy…

Hauchdünne Smart Textiles werden für den Einsatz im geburtsmedizinischen Monitoring weiterentwickelt und sollen eine Analyse der Vitaldaten via App für die Schwangeren ermöglichen. © Adobe Stock #355517511 / Ultra-thin smart textiles are being refined for their use in obstetric monitoring and will enable analysis of vital data via app for pregnancies. © Adobe Stock #355517511

Im Frühjahr traf sich das Newlife-Konsortium am Fraunhofer IZM in Berlin. © Fraunhofer IZM / The Newlife consortium gathered at Fraunhofer IZM in Berlin in spring. © Fraunhofer IZM

11.07.2023
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Systems

Safe Start for New Life – Intelligent Patch for Remote Monitoring of Pregnancy

During pregnancy, regular medical check-ups provide information about the health and development of the pregnant person and the child. However, these examinations only provide snapshots of their state, which can be dangerous, especially in high-risk cases. To enable convenient and continuous monitor…

Das Kernstück der Spektroskopie-Kapsel beinhaltet das System-in-Package, eine flexible Leiterplatte und eine Keramikplatte. © Fraunhofer IZM / The core of the spectroscopy capsule contains the system-in-package, a flexible circuit board, and a ceramic pcb. © Fraunhofer IZM

© Micro Systems Technologies (MST) / © Micro Systems Technologies (MST)

Ausstattung und Funktionen der Pille © Micro Systems Technologies (MST) / Features and functions of the pill © Micro Systems Technologies (MST)

Misst Impedanzen in schwer erreichbaren Bereichen: Superminiaturisierter IoT Sensor. © Fraunhofer IZM / Impedance measurement in hard-to-reach areas: Super-miniaturized IoT sensor. © Fraunhofer IZM

02.06.2023
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Science

The World’s Smallest Impedance Spectroscopy System in the Form of a Pill Finds Weak Spots in Machines and People

Imagine a scenario where you simply just throw in a pill to identify an error—this is now one step closer to reality thanks to the work done by researchers at Fraunhofer IZM in cooperation with Micro Systems Technologies (MST) and Sensry GmbH. As small as a piece of candy, the waterproof IoT senso…

Photonischer Chip mit vier Mikroflaschenresonatoren © Fraunhofer IZM / Photonic chip with four bottle microresonators © Fraunhofer IZM

Optofluidische Kartusche zur Zytokin-Erkennung © Fraunhofer IZM | Volker Mai / Optofluidic cartridge for detection of cytokines © Fraunhofer IZM | Volker Mai

25.03.2022
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Science

Point-of-care diagnostics for multiple diseases, courtesy of photonics technology

Since the arrival of COVID 19, PCR and other antigen tests have turned from sophisticated tools known only to medical professionals into an everyday experience for all of us. To mark the successful completion of their research on the PoC-BoSens platform, the international project consortium led by F…

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