![Mitarbeitende von EV Group und des Fraunhofer IZM-ASSID neben einem vollautomatischen EVG®850 DB UV-Laser-Debonding- und Reinigungssystem, installiert im neu eröffneten Center for Advanced CMOS and Heterointegration Saxony (CEASAX) von Fraunhofer in Dresden, Deutschland. [Vin links nach recths: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf / EV Group and Fraunhofer IZM-ASSID personnel next to an EVG®850 DB fully automated UV laser debonding and cleaning system installed in Fraunhofer’s newly established Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. [From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf Mitarbeitende von EV Group und des Fraunhofer IZM-ASSID neben einem vollautomatischen EVG®850 DB UV-Laser-Debonding- und Reinigungssystem, installiert im neu eröffneten Center for Advanced CMOS and Heterointegration Saxony (CEASAX) von Fraunhofer in Dresden, Deutschland. [Vin links nach recths: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf / EV Group and Fraunhofer IZM-ASSID personnel next to an EVG®850 DB fully automated UV laser debonding and cleaning system installed in Fraunhofer’s newly established Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. [From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf](/uploads/images/_scale/dsc4037klein_169_626x352.jpg)
-
- Elektronik (Wafer, Halbleiter, Mikrochips,...)
Strategische Partnerschaft startet mit der Installation des vollautomatischen EVG®850 Laser Debonding-Systems im neu eröffneten Center for Advanced CMOS and Heterointegration Saxony (CEASAX)
EV Group und Fraunhofer IZM-ASSID bauen Partnerschaft beim Wafer-Bonden für Quantum Computing-Anwendungen aus
EV Group (EVG), ein führender Entwickler und Hersteller von Anlagen für Waferbonding- und Lithographieanwendungen in der Halbleiterindustrie, Mikrosystemtechnik und Nanotechnologie, und Fraunhofer IZM-ASSID (All Silicon System Integration Dresden), ein Institutsteil des Fraunhofer IZM, der weltwei…